Monday, November 26, 2012

1211.5229 (M. Bomben et al.)

Development of Edgeless n-on-p Planar Pixel Sensors for future ATLAS
Upgrades
   [PDF]

M. Bomben, A. Bagolini, M. Boscardin, L. Bosisio, G. Calderini, J. Chauveau, G. Giacomini, A. La Rosa, G. Marchori, N. Zorzi
The development of n-on-p "edgeless" planar pixel sensors being fabricated at FBK (Trento, Italy), aimed at the upgrade of the ATLAS Inner Detector for the High Luminosity phase of the Large Hadron Collider (HL-LHC), is reported. A characterizing feature of the devices is the reduced dead area at the edge, achieved by adopting the "active edge" technology, based on a deep etched trench, suitably doped to make an ohmic contact to the substrate. The project is presented, along with the active edge process, the sensor design for this first n-on-p production and a selection of simulation results, including the expected charge collection efficiency after radiation fluence of $1 \times 10^{15} {\rm n_{eq}}/{\rm cm}^2$ comparable to those expected at HL-LHC (about ten years of running, with an integrated luminosity of 3000 fb$^{-1}$) for the outer pixel layers. We show that, after irradiation, more than 50% of the signal should be collected in the edge region; this confirms the validity of the active edge approach.
View original: http://arxiv.org/abs/1211.5229

No comments:

Post a Comment